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UV396US UV Release Tape for BGA Semiconductor Packaging | UV-Curable Low Residue Dicing Tape for Wafer Processing, Die Bonding, Back Grinding & Chip Mounting - B2B Custom Wholesale KHJ Manufacturer

UV396US UV Release Tape for BGA Semiconductor Packaging | UV-Curable Low Residue Dicing Tape for Wafer Processing, Die Bonding, Back Grinding & Chip Mounting - B2B Custom Wholesale KHJ Manufacturer

Marchio: KHJ
Numero di modello: UV396US
Informazione dettagliata
Luogo di origine:
Cina
Certificazione:
RoHS
Descrizione di prodotto
Description UV396US is a single-sided, UV-curable release tape engineered for temporary bonding applications. It offers strong initial tack that holds materials firmly in place during processing; after exposure to UV light, the adhesive's bonding force drops sharply, allowing the tape to be peeled away quickly and cleanly. Construction Features Consistent, dependable performance across repeated process cycles Strong immediate adhesion secures components firmly during